Specialist - Engineering Asst
The Advanced Imager Technology Group performs research and development of imager devices and subsystem-level technology for the DoD and scientific community. The imager efforts include advanced silicon-based and compound semiconductor-based focal-plane technologies for applications such as ground- and space-based surveillance, adaptive optics, and astronomy. These focal planes address special requirements, for example, large-format gigapixel arrays, very-high-speed imagers, time-of-arrival detectors (LADAR receiver), and low-light-level imaging applications. The group's efforts span the range of device and materials development, integrated circuit design and fabrication, custom packaging, detector hybridization, and the development of control and readout electronics for system-level demonstrations.
Job DescriptionThe Advanced Imager Technology Group is seeking to hire a specialist with responsibilities in the fabrication and packaging of compound semiconductor devices. The work will include advanced packaging (for example, alignment and attachment processes of various semiconductor devices with sub-micron accuracy) and / or the photolithography, etching, and deposition techniques used to fabricate novel compound semiconductor (III-V) photodetector arrays. This is a hands-on position that will involve process development and operation of manual and semi-automated equipment for fabrication and packaging.
Requirements:
Graduation from a two year technical school or Bachelor s degree or 5 years of experience with fabricating and / or packaging various semiconductor and optical materials. Previous experience with hands-on microfabrication techniques and / or epoxy and solder attachment techniques is preferred. Must be capable of establishing and following standard operating procedures (SOPs), have strong data analysis skills, and demonstrated written and oral communication skills. Must be able to work independently and in a team environment. Basic computer skills and experience with Microsoft Office applications are required. Experience with the development of measurement systems including the generation of data acquisition software (e.g., Matlab) and CAD knowledge is preferred.
For Benefits Information, click http:
//hrweb.mit.edu/benefits
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
Requisition ID:
31059
|
|
 | |
